Shielded twisted pair of conductors using conductive ink

ABSTRACT

An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 13/753,117,filed 29 Jan. 2013 (the '117 application), now pending. The '117application is hereby incorporated by reference as though fully setforth herein.

BACKGROUND

a. Field of the Disclosure

The instant disclosure relates generally to formed electrical conductorshaving various layers of electrically conductive and electricallynonconductive materials.

b. Background

Various diagnostic and therapeutic procedures in or on the body of apatient, such as in the circulatory system, the gastrointestinal tract,the brain vessels, the bronchial tree or the like may be performed orfacilitated by inserting medical devices into a body lumen andthereafter navigating the diagnostic or therapeutic medical devices tothe target anatomical site. Electrically operated objects on a distalportion of the medical device may be utilized to facilitate thediagnostic, therapeutic, and navigational functions of the medicaldevice. A proximal portion of the medical device may be operativelyconnected to a control unit which electrically communicates with theobjects located on the distal portion.

To provide an electrical infrastructure for transmitting electricalsignals, very small cables, such as but not limited to, shielded twistedpair of wires, may be utilized to connect electrically operated objectslocated on the distal portion of the medical device to the proximalportion of the medical device. For example, shielded twisted pair ofwires are well known in the art for providing the benefit of reducingelectromagnetic interference and may be used to connect the distalportion to the proximal portion of the medical device.

The foregoing discussion is intended only to illustrate the presentfield and should not be taken as a disavowal of claim scope.

BRIEF SUMMARY

In an embodiment, an apparatus for transmitting electrical signals mayinclude a substrate and a twisted pair of conductors located on thenonconductive substrate. The twisted pair of conductors has a firstlayer comprising conductive material, a second layer comprisingnonconductive material, and a third layer comprising conductivematerial. The first layer has a plurality of segments separated by aplurality of gaps. The second layer is positioned in the gaps andelectrically insulates a portion of the segments positioned within thegaps. The third layer is positioned over the second layer. The thirdlayer is configured to electrically connect an end of one segment to anend of another segment. The twisted pair of conductors formed by thethree dimensional structure comprises two electrically separateconductors twisted about each other.

In an embodiment, an apparatus may comprise a substrate, a circuitlayer, and a shield. The circuit layer may be located on the substrate.The circuit layer may have a conductor layer comprising conductivematerial, and an insulator comprising a lower insulator layer and anupper insulator layer. The conductor layer may be located between thelower insulator layer and the upper insulator layer. The shield may havea lower shield layer and an upper shield layer. The circuit layer may belocated between the lower shield layer and the upper shield layer.

In an embodiment, a method for manufacturing an electricalinfrastructure of a medical device may comprise forming a base layer,forming a masking layer, and forming a bridge layer. The base layer maycomprise conductive material, formed in a predefined pattern on asurface of the medical device. The masking layer may comprisenonconductive material formed directly over a portion of the first layerof conductive material. The bridge layer may comprise conductivematerial formed directly over a portion of the first layer of conductivematerial and a portion of the masking layer.

The foregoing and other aspects, features, details, utilities, andadvantages of the present disclosure will be apparent from reading thefollowing description and claims, and from reviewing the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic and block diagram view of a system demonstratingan environment in which a medical device having a formed electricalinfrastructure may be used.

FIG. 2 is a diagrammatic view of an exemplary catheter-lab environmentin which the system of FIG. 1, particularly a medical device having aformed electrical infrastructure may be used.

FIG. 3 is a diagrammatic top view of a medical device having anembodiment of a formed electrical infrastructure.

FIG. 4 is a diagrammatic top view showing in greater detail, theembodiment of the formed electrical infrastructure of FIG. 3.

FIG. 5 is an enlarged view of a portion of the electrical infrastructureof FIG. 4 which generally illustrates an embodiment of a twisted pair ofconductors.

FIG. 6A is a cross-sectional view taken substantially along lines 6A-6Ain FIG. 5.

FIG. 6B is a cross-sectional view of an embodiment of an insulatedtwisted pair of conductors.

FIG. 6C is a cross-sectional view of an embodiment of a shielded twistedpair of conductors.

FIG. 7 is a cross-sectional view taken substantially along lines 7-7 inFIG. 5.

FIGS. 8A-8G are diagrammatic top views of layers of an embodiment of atwisted pair of conductors.

FIG. 9 is a cross-sectional view of an embodiment of a three dimensionalformed pair of conductors.

FIGS. 10A-B are cross-sectional side views of a portion of a positionsensor coil of the medical device of FIG. 3.

FIG. 11 is a schematic and block diagram view of one exemplaryembodiment of a medical positioning system (MPS) as shown in block formin FIG. 1.

DETAILED DESCRIPTION

Various embodiments are described herein to various apparatuses,systems, and/or methods. Numerous specific details are set forth toprovide a thorough understanding of the overall structure, function,manufacture, and use of the embodiments as described in thespecification and illustrated in the accompanying drawings. It will beunderstood by those skilled in the art, however, that the embodimentsmay be practiced without such specific details. In other instances,well-known operations, components, and elements have not been describedin detail so as not to obscure the embodiments described in thespecification. Those of ordinary skill in the art will understand thatthe embodiments described and illustrated herein are non-limitingexamples, and thus it can be appreciated that the specific structuraland functional details disclosed herein may be representative and do notnecessarily limit the scope of the embodiments, the scope of which isdefined solely by the appended claims.

Reference throughout the specification to “various embodiments,” “someembodiments,” “one embodiment,” or “an embodiment,” or the like, meansthat a particular feature, structure, or characteristic described inconnection with the embodiment is included in at least one embodiment.Thus, appearances of the phrases “in various embodiments,” “in someembodiments,” “in one embodiment,” or “in an embodiment,” or the like,in places throughout the specification are not necessarily all referringto the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments. Thus, the particular features, structures, orcharacteristics illustrated or described in connection with oneembodiment may be combined, in whole or in part, with the features,structures, or characteristics of one or more other embodiments withoutlimitation given that such combination is not illogical ornon-functional.

It will be appreciated that the terms “proximal” and “distal” may beused throughout the specification with reference to a clinicianmanipulating one end of a medical device or instrument used to treat apatient. The term “proximal” refers to the portion of the device closestto the clinician and the term “distal” refers to the portion locatedfurthest from the clinician. It will be further appreciated that forconciseness and clarity, spatial terms such as “vertical,” “horizontal,”“up,” and “down” may be used herein with respect to the illustratedembodiments. However, medical devices may be used in many orientationsand positions, and these terms are not intended to be limiting orabsolute.

Before proceeding with a detailed description of a formed electricalinfrastructure, a general description of an exemplary system in which amedical device 26 having such a formed electrical infrastructure 44 maybe used is set forth below. As will be described hereinafter,embodiments of such an electrical infrastructure are configuredgenerally for transmitting electrical signals in a medical device, forexample, so as to connect electrically operated objects located on thedistal portion of the medical device to the proximal portion of themedical device. Embodiments of such an electrical infrastructure mayhave similar properties as a shielded twisted pair of wires, forexample, for providing the benefit of reducing electromagneticinterference. In addition, embodiments of such an electricalinfrastructure may provide improvements relative to a shielded twistedpair of wires, which may be characterized as being relatively expensiveto manufacture, relatively hard to handle due to their size, relativelymechanically sensitive, and in some instances too large to implement inmedical devices having limited space without affecting the medicaldevice's mechanical properties. Finally, embodiments of such anelectrical infrastructure may be located directly on a surface of themedical device.

Referring now to the drawings wherein like reference numerals are usedto identify identical or similar components in the various views, FIG. 1is a block diagram view of a system 10 in which a medical device 26having a formed electrical infrastructure 44 may be used. System 10 asdepicted includes a main electronic control unit 12 (e.g., including oneor more electronic processors) having various input/output mechanisms14, a display 16, an optional image database 18, a localization systemsuch as a medical positioning system (MPS) 20, an electrocardiogram(ECG) monitor 22, one or more MPS location sensors respectivelydesignated 24 ₁ and 24 ₂, and an MPS-enabled medical device 26 whichitself includes one and optionally more MPS location sensors, shown inexemplary fashion as having one such sensor 24 ₁. Input/outputmechanisms 14 may comprise conventional apparatus for interfacing with acomputer-based control unit, for example, a keyboard, a mouse, a tablet,a foot pedal, a switch or the like. Display 16 may also compriseconventional apparatus.

FIG. 2 is a diagrammatic view of system 10 as incorporated into a largersystem, namely, a catheter lab. More specifically, system 10 is shown asbeing incorporated into a fluoroscopic imaging system 28, which mayinclude commercially available fluoroscopic imaging components. Itshould be understood that while embodiments may be used in thecatheter-lab environment to be described below, this is exemplary onlyand not limiting in nature. MPS 20 includes a magnetic transmitterassembly (MTA) 30 and a magnetic processing core 32 for determininglocation (P&O) readings. MTA 30 is configured to generate the magneticfield(s) in and around the patient's chest cavity, in a predefinedthree-dimensional space identified as a motion box 34. MPS sensors 24_(i) as described above are configured to sense one or morecharacteristics of the magnetic field(s) and when the sensors are inmotion box 34, each generate a respective signal that is provided tomagnetic processing core 32. Processing core 32 is responsive to thesedetected signals and is configured to calculate respective P&O readingsfor each MPS sensor 24 _(i) in motion box 34. Thus, MPS 20 enablesreal-time tracking of each sensor 24 _(i) in three-dimensional space.

The positional relationship between the image coordinate system and theMPS reference coordinate system may be calculated based on a knownoptical-magnetic calibration of the system (e.g., established duringsetup), since the positioning system and imaging system may beconsidered fixed relative to each other in such an embodiment. However,for other embodiments using other imaging modalities, includingembodiments where the image data is acquired at an earlier time and thenimported from an external source (e.g., imaging data stored in database18), a registration step registering the MPS coordinate system and theimage coordinate system may need to be performed so that MPS locationreadings can be properly coordinated with any particular image beingused. One exemplary embodiment of a MPS 20 will be described in greaterdetail below in connection with FIG. 11.

As described above and generally illustrated in FIGS. 1 and 2, themedical device 26 may require an electrical infrastructure in order toelectrically connect objects located at a distal end portion of themedical device 26, such as one or more location sensors 24 _(i), to aconnector or the like at a proximal end portion of the medical device26. The proximal end portion of the medical device 26 can then beelectrically connected various apparatus (e.g., MPS 20 or main controlunit 12) to establish electrical communication between the variousapparatus and the objects.

FIG. 3 is a diagrammatic top view, with portions broken away, of amedical device 36 having a first embodiment of an electricalinfrastructure, designated infrastructure 48. The medical device 36 canbe used in the system 10 that was shown and described in connection withFIGS. 1 and 2. Medical device 36 may include an elongate tubular body 38having a distal end 40 and a proximal end 42. In various embodiments,the medical device 36 may comprise devices such as a catheter or aguidewire. The medical device 36 may further include anelectrically-operated object, such as a location sensing coil 44. Thelocation sensing coil 44 may be located at the distal end 40 of themedical device 36, although variations as to the electrical functionperformed by the object as well as its location are possible. Thelocation sensing coil 44 may comprise an electromagnetic field-basedpositioning device, such as a magnetic field sensing coil 44 configuredto produce a signal from which a sensor location can be determined(e.g., by the MPS 20). The determined sensor location may be used tofacilitate various tracking, navigation, orientation, and otherlocation-based or location-enabled functions of MPS 20.

The medical device 36 may further include an electrical connector or thelike disposed at the proximal end 42. Such an electrical connector maycomprise a contact ring 46 or, in the illustrated embodiment, aplurality of contact rings 46 _(1-N). The contact rings 46 _(1-N) may beconfigured to electrically connect the medical device 36 (i.e.,electrically-operable objects thereof, such as location sensing coil 44)to a corresponding electrical apparatus, such as the MPS 20 and/or themain control unit 12. In one embodiment, for example, the plurality ofcontact rings 46 _(1-N) at the proximal end 42 may be configured as amale connector configured to be inserted into a corresponding femaleconnector (not shown) that is in electrical communication with anexternal apparatus, such as the MPS 20 and/or the control unit 12. In anembodiment, other than with respect to the particular trace to which acontact ring is electrically connected, the plurality of contact rings46 _(1-N) are electrically insulated on an underside thereof withrespect to the traces that lead to the electrical infrastructure 48 forfurther connection to the distal end of the medical device 36.

The electrical infrastructure 48 (shown in block form in FIG. 3) isconfigured to allow electrically communication between one electricalobject, such as the location sensing coil 44 at the distal end 40, andanother electrical object, such as the contact rings 46 _(1-N) at theproximal end 42. Electrical infrastructure 48 may be located on body 38of medical device 36, in a lumen of body 38 of medical device 36, andmay be directly formed on body 38, such as an interior or exterior wallof body 38. Additionally, a plurality of electrical infrastructures 48may be located in combination on various portions of the medical device36.

In the illustrated embodiment of FIG. 3, the electrical infrastructure48 is configured to (i) electrically connect contact ring 46 ₁ to afirst conductor end 94 of the location sensing coil 44; (ii)electrically connect contact ring 46 ₂ to an electrically-conductiveshield layer (shown in FIG. 4 as layer 78 ₂); and (iii) electricallyconnect contact ring 46 _(N) to a second conductor end 96 of thelocation sensing coil 44. These manner of these electrical connects willbe described and illustrated in greater detail below in connection withFIG. 4.

FIG. 4 is a diagrammatic top view, with portions broken away, of furtherembodiment of an electrical infrastructure, designated infrastructure 48a. The electrical infrastructure 48 a is configured to provideelectrical pathways to allow transmission of electrical signals from thedistal end 40 of the medical device 36 to the proximal end 42 of themedical device 36. In general, a device like the medical device 36 mayuse tiny electrical cables (i.e., conventional twisted pair (TP) cable)that may be expensive to manufacture, hard to handle, mechanicallysensitive, and in some instances too “big” to implement in such deviceswith limited space without significantly affecting the mechanicalproperties of the device. As currently disclosed, however, embodimentsof an electrical infrastructure consistent with the teachings hereinprovide various advantages, such as using reduced space, beingpotentially less expensive to manufacture, and potentially minimizing oreliminating the need for handling during production of the medicaldevice into which it is incorporated.

The electrical infrastructure 48 a may comprise a twisted pair ofconductors, collectively designated 52, located on a substrate 50, suchas the elongated body 38 of the medical device 36. The pair ofconductors 52 include electrically separate conductors—designated 52_(A), 52 _(B)—that are “twisted” about each other. As used herein,“twisted” conductors may refer to conductors that are inter-woven,alternated, braided, twisted, or otherwise comprising such aconfiguration. The “twist” of the conductors 52 _(A), 52 _(B), helpsreject electromagnetic noise that might otherwise be picked up by theconductors 52 _(A), 52 _(B). In an embodiment, the twisted pair ofconductors 52 may be formed through a process (described in greaterbelow) forming a first layer of electrically conductive material 54, asecond layer of electrically nonconductive material 56, and a thirdlayer of electrically conductive material 58. Each subsequent layer maybe formed over at least a portion of the preceding layer in a mannerdescribed below.

In an embodiment, the conductive and nonconductive materials may be anelectrically conductive ink or electrically nonconductive ink,respectively. The conductive and nonconductive materials may be formedby depositing or printing directly on a surface, such as the substrate50, and directly over pre-existing layers of existing conductive andnonconductive materials. The conductive and nonconductive materials maybe formed directly on components of the medical device 36 usingtechnologies such as ink jet printing, pad printing, aerosol jetdeposition that may be known in the art as aerosol jet printing (AJP),three-dimensional (3D) micro-printing, and other printing technologiesas known to those of skill in the art.

In an embodiment, the substrate 50 may comprise an outer surface of theelongated body 38 of the medical device 36. In another embodiment, thesubstrate 50 may comprise a separate component from the elongated body38 that is configured to attach to the medical device 36, either on thebody 38 or within a lumen of the body 38 of the medical device 36. Thethree dimensional layering of conductive and nonconductive materials maybe formed in a predetermined pattern and/or configuration to provideend-to-end electrical connectivity.

The electrical infrastructure 48 a may comprise, as described above,conductors designated 52 _(A) and 52 _(B) disposed on the substrate 50.The conductors 52 _(A), 52 _(B) are electrically isolated from eachother and are formed in an inter-woven, alternating, braided, or twistedarrangement (hereinafter “twisted pair” 52). The twisted pair 52 mayhave a multi-layered construction of conductive layers and nonconductivelayers stacked upon each other to replicate the twisting of a pair ofwires that exists in a conventional twisted pair (TP) cable.

The electrical infrastructure 48 a includes the twisted pair ofconductors 52 as described above may be formed as a shielded twistedpair of conductors, designated by reference numeral 80, as shown in FIG.4, and as further shown in FIG. 6C. The shielding function can beimplemented by including an isolation layer 76 and a shielding layer 78.In this regard, the substrate 50 comprises (i) lower isolation andshielding layers (76 ₁, 78 ₁ best shown in FIG. 6C), which are formedunderneath the twisted pair of conductors 52; and (ii) upper isolationand shielding layers 76 ₂, 78 ₂, which are formed on top of the twistedpair of conductors 52. In FIG. 4, the upper isolation layer 76 ₂, andthe upper shielding layer 78 ₂, have been partially broken away to showthe twisted pair of conductors 52.

With continued reference to FIG. 4, an electrically conductive trace 51₁ is electrically coupled to conductor 52B, which is furtherelectrically connected to the first conductor end 94 of the locationsensing coil 44. In addition, an electrically conductive trace 51 ₂ iselectrically connected to shielding layer 78 ₂, which may be coupled toa ground or reference node. Finally, an electrically conductive trace 51_(N) is electrically coupled to conductor 52 _(A), which is furtherelectrically connected to the second conductor end 96 of the locationsensing coil 44. The electrically conductive traces 51 ₁, 51 ₂, 51 _(N)may be electrically connected to contact rings 46 ₁, 46 ₂, 46 _(N), asshown in FIG. 3.

FIG. 5 generally illustrates an enlarged view of one of the multipleintersections of conductor 52 _(A) and conductor 52 _(B) shown in FIG.4. It should be understood that the description of the conductors 52A,52B applies with equal force to both shielded and unshielded twistedpair embodiments. In an embodiment, twisted pair 52 may comprise a firstlayer of conductive material 54, a second layer of nonconductivematerial 56, and a third layer of conductive material 58. First layer ofconductive material 54 may comprise a plurality of electricallyconductive segments 60 separated by a gap 62. For example, threesegments 60 ₁, 60 ₂, 60 ₃ are illustrated in FIG. 5. A first segment 60₁ and a second segment 60 ₂ are separated by gap 62. A third segment 60₃ traverses through gap 62 without contacting first segment 60 ₁ andsecond segment 60 ₂. In order to connect first segment 60 ₁ to secondsegment 60 ₂ without touching third segment 60 ₃, second layer ofnonconductive material 56 is located in gap 62 to directly cover aportion of third segment 60 ₃. Second layer of nonconductive material 56comprises an insulator masking 64 configured to electrically insulate aportion of third segment 60 ₃ located in gap 62. Third layer ofconductive material 58 may then be located directly on second layer ofnonconductive material 56. Third layer of conductive material 58 maycomprise a conductive bridge 70 configured to electrically connect firstsegment 60 ₁ to second segment 60 ₂ while remaining electricallyisolated from third segment 60 ₃ because of insulator masking 64.

While FIG. 5 generally illustrates one of the multiple intersections ofelectrical infrastructure 48 a, the above described structure may berepeated throughout the remaining intersections. The resultant structureallows conductor 52 _(A) to cross the path of conductor 52 _(B) in atwisted arrangement while remaining electrically isolated from eachother.

FIGS. 6A and 7 are cross-sectional views of a further embodiment of anelectrical infrastructure, designated infrastructure 48 b, takensubstantially along lines 6A-6A and 7-7 in FIG. 5, respectively. Theinfrastructure 48 b, as illustrated, is unshielded and is formed on thesubstrate 50. To replicate the twisted configuration of a conventionalTP cable in a layered structure, the insulator masking 64 separates theconductor 52 _(A) and the conductor 52 _(B) in the intersection of thetwo conductors. As illustrated, the twisted pair 52 comprises stackedlayers formed on top of each other to allow the conductor 52 _(A) andthe conductor 52 _(B) to cross without electrically contacting eachother. For example, the third segment 60 ₃ of the first layer ofconductive material 54 may be located on the substrate 50. The insulatormasking 64 of the second layer of nonconductive material 56 may belocated on a portion of the third segment 60 ₃ such that a top surface66 and side surfaces 68 of the third segment 60 ₃ are electricallyinsulated by nonconductive material. A bridge 70 of the third layer ofconductive material 58 may be located on the insulator masking 64. Byproviding nonconductive material between the first layer of conductivematerial 54 and the third layer of conductive material 58, the conductor52 _(A) and the conductor 52 _(B) may cross without contacting eachother.

In an exemplary embodiment of electrical infrastructure 48 b, thedistance D between an edge of the conductor 52 _(A) and an edge of theconductor 52 _(B) may be about 0.1 mm. The segments 60 may have a widthW₁ of about 0.04 mm and a thickness T₁ of about 0.002 mm. The insulatormaskings 64 may have a width that is wider than the width W₁ of segments60. Insulator maskings 64 may have a general thickness T₂ of about 0.001mm and a length L₁ of about 0.05 mm. The length L₁ of the insulatormaskings 64 may be about the same size as the span of the gaps 62. Theconductive bridges 70 may have a width W₂ of about 0.04 mm, and may begenerally the same width as the segments 60. The conductive bridges 70may have a thickness T₃ of about 0.002 mm and a length L₂ of about 0.095mm. The length L₂ of conductive bridges 70 may be configured such thatconductive bridges 70 are longer than the insulator maskings 64. Whilevarious dimensions of the disclosed layers of twisted pair 52 have beenprovided in detail, it will be appreciated that this disclosure is notso limited. Rather, other dimensions may be utilized as known to thosewith skill in the art and remain within the scope and spirit of thisdisclosure.

FIG. 6B is a cross-sectional view of a further embodiment of anelectrical infrastructure, designated infrastructure 48 c. In particularsituations, it may be desirable to electrically insulate the twistedpair of conductors, and thus electrical isolation layers are providedfor such purpose. For example, the substrate 50 may be an electricallyconductive material and therefore the twisted pair of conductors 52would need to be electrically isolated from the underlying substrate 50.Additionally, insulating the twisted pair of conductors 52 may alsoprovide physical protection to the electrical infrastructure 48 c.

The insulated twisted pair of conductors of infrastructure 48 c maycomprise the twisted pair of conductors 52, as described above, butfurther surrounded by electrical isolation layers 76 of electricallyinsulating (i.e., electrically nonconductive) material. Isolation layers76 may comprise a lower isolation layer 76 ₁ and an upper isolationlayer 76 ₂. The lower isolation layer 76 ₁ may be positioned onto anupper surface of the substrate 50. The twisted pair of conductors 52 maythen be positioned onto an upper surface of the lower isolation layer 76₁. After the twisted pair of conductors 52 have been formed on lowerisolation layer 76 ₁, then the upper isolation layer 76 ₂ may bepositioned over and formed on the twisted pair of conductors 52 and theupper surface of the lower isolation layer 76 ₁. The isolation layers 76may surround an intermediate portion of the twisted pair of conductors52. For example, the ends of conductors 52 _(A), 52 _(B) may not becovered by the isolation layers 76. The ends of the conductors 52 _(A),52 _(B) may be configured to connect to electrical objects (e.g.,location sensing coil 44) located at or near the distal end 40, on theone hand, and objects at or near the proximal end 42 of the medicaldevice 36, on the other hand (e.g., contact ring 46). In an embodimentwhere the substrate 50 is a nonconductive material, the lower isolationlayer 76 ₁ may not be necessary. In other words, the twisted pair ofconductors 52 may be formed directly onto the substrate 50, and then theupper isolation layer 76 ₂ may be placed on top of the twisted pair ofconductors 52 and the substrate 50. In an exemplary embodiment, a widthW₃ of both the lower isolation layer 76 ₁ and the upper isolation layer76 ₂ may be about 0.2 mm. A thickness T₄ of both the lower isolationlayer 76 ₁ and the upper isolation layer 76 ₂ may be about 0.001 mm.While various dimensions of the isolation layers 76 have been providedin detail, it will be appreciated that this disclosure is not solimited. Rather, other dimensions may be utilized as known to those withskill in the art and remain within the scope and spirit of thisdisclosure.

FIG. 6C is a cross-sectional view of a still further embodiment of anelectrical infrastructure, designated infrastructure 48 d. Theelectrical infrastructure 48 d may include, in addition to the twistedpair of conductors 52, both isolation and shielding layers so as to forma shielded twisted pair of conductors 80. In particular situations, itmay be desirable to electrically shield the twisted pair of conductors52. Electrical shielding 78 may reduce or eliminate electricalinterference. Additionally, the electrical shielding 78 may providephysical protection to the twisted pair of conductors 52.

The shielded twisted pair of conductors 80 may comprise an insulatedtwisted pair of conductors 52, such as in FIG. 6B, but furthersurrounded by a plurality of shield layers 78 comprising electricallyconductive material. The shield layers 78 may be configured to act as anelectrical shield for the twisted pair of conductors 52, forming theshielded twisted pair of conductors 80. The shield layers 78 maycomprise a lower shield layer 78 ₁ and an upper shield layer 78 ₂. In anembodiment, the lower shield layer 78 ₁ may be located directly on asurface of the substrate 50. As generally illustrated, the substrate 50does not need to be a flat planar surface. Rather, the substrate 50 mayhave a curved surface or contoured surface, and twisted pair ofconductors 52, whether or not insulated, and whether or not shielded,may be formed directly on the curved or contoured surface, such as butnot limited to, the tubular body 38 of the medical device 26. The lowerisolation layer 76 ₁ may be located on the lower shield layer 78 ₁. Theformed twisted pair 52 may be located on the lower isolation layer 76 ₁.The upper isolation layer 76 ₂ may be located over the formed twistedpair of conductors 52 and the lower isolation layer 76 ₁. The uppershield layer 78 ₂ may be located over the upper isolation layer 76 ₂.The lower layer 78 ₁ and the upper layer 78 ₂ may be in electricalcontact with each other. In an exemplary embodiment, both the lowerlayer 78 ₁ and the upper layer 78 ₂ may have a width W₄ of about 0.4 mmand a thickness T₅ of about 0.002 mm. While various dimensions of theshield layers 76 have been provided in detail, it will be appreciatedthat this disclosure is not so limited. Rather, other dimensions may beutilized as known to those with skill in the art and remain within thescope and spirit of this disclosure.

While the shielded twisted pair 80 has been disclosed as having onetwisted pair of conductors 52 within shielding 78, this disclosure isnot so limited. Rather, the shielded twisted pair 80 may comprise aplurality of twisted pairs of conductors 52 located within the shieldinglayer 78.

Referring to FIGS. 8A-8G, a method of manufacturing an embodiment of theshielded twisted pair of conductors 80 of FIG. 6C will now be set forth.Each of the various figures generally illustrates a respective layer ofan embodiment of the shielded twisted pair of conductors 80.

The lower shield layer 78 ₁, generally illustrated in FIG. 8A,comprising electrically conductive ink may be formed onto the substrate50. While the method refers to forming, any deposition technology ofelectrically conductive and electrically nonconductive materials asknown to those with skill in the art may be utilized. The lowerisolation layer 76 ₁ (generally illustrated in FIG. 8B) comprisingelectrically nonconductive ink may be formed onto the lower shield layer78 ₁.

A base layer of plurality of segments 60 comprising electricallyconductive ink may be formed on the lower isolating layer 76 ₁ in apredetermined pattern. One embodiment of the predetermined pattern isgenerally illustrated in FIG. 8C, where the segments 60 are separated bygaps 62. The gaps 62 may have a span identified on FIG. 8C as A₁-A₁,B₁-B₁, A₂-A₂, B₂-B₂, . . . A_(N)-A_(N), B_(N)-B_(N). While a limitedamount of gaps 62 and related span of the gap relative to segments 60are generally illustrated, it will be appreciated that this disclosureis not so limited. Rather any number of segments 60 and gaps 62 may beutilized for a particular application of this disclosure as known tothose with skill in the art. Adjacent segments 60 may cross paths viagaps 62 without touching other segments 60. While unconnected to anyadditional layers, each individual segment of the plurality of segments60 is electrically isolated from the other segments 60. The segments 60may be, in non-limiting, exemplary embodiments, generally sinusoidalshaped, or in other words, “S” shaped or lazy-“S” shaped.

A plurality of the insulator maskings 64 comprising electricallynonconductive ink may be formed in the gaps 62 between the segments 60.The insulator maskings 64 may cover a portion of the segments 60 locatedin the gaps 62. As generally illustrated in FIG. 8D, the insulatormaskings 64 may be located in the gaps 62 having spans A₁-A₁, B₁-B₁,A₂-A₂, B₂-B₂, . . . A_(N)-A_(N), B_(N)-B_(N).

The insulator maskings 64 may cover portions of a top surface 66 andside surfaces 68 of the segments 60. The insulator maskings 64 may beconfigured to electrically insulate the conductor 52 _(A) from theconductor 52 _(B).

A plurality of conductive bridges 70 comprising electrically conductiveink may be formed on the insulator maskings 64 to electrically connectadjacent segments 60. As generally illustrated in FIG. 8E, theconductive bridges 70 may be located in the gaps 62 and a portion of theends of the segments 60 from spans A₁-A₁, B₁-B₁, A₂-A₂, B₂-B₂, . . .A_(N)-A_(N), B_(N)-B_(N).

The upper isolation layer 76 ₂ (generally illustrated in FIG. 8F)comprising electrically nonconductive ink may be formed onto the layersof segments 60, insulator maskings 64, conductive bridges 70, and lowershield layer 78 ₁. The upper shield layer 78 ₂ (generally illustrated inFIG. 8G) comprising electrically conductive ink may be formed onto theupper isolation layer 76 ₂ and the lower shield layer 78 ₁. The uppershield layer 78 ₂ may be electrically connected to the lower shieldlayer 78 ₁.

FIG. 9 generally illustrates a cross-sectional view of yet anotherembodiment of an electrical infrastructure, designated electricalinfrastructure 48 e. A three-dimensional layered electricalinfrastructure 48 e may comprise lower shield layer 78 ₁, lowerisolation layer 76 ₁, a first circuit layer 82, an insulation layer 84,a second circuit layer 86, upper isolation layer 76 ₂, and upper shieldlayer 78 ₂. In an embodiment, each of the layers may be formed upon theproceeding layer.

For example, in an exemplary embodiment, the lower shield layer 78 ₁comprising electrically conductive material may be formed onto thesubstrate 50. The lower shield layer 78 ₁ may have width W₄ of about 0.4mm and thickness T₅ of about 0.002 mm. The lower isolation layer 76 ₁comprising electrically nonconductive material may be formed onto thelower shield layer 78 ₁. The lower isolation layer 76 ₁ may have widthW₃ of about 0.15 mm and thickness T₄ of about 0.001 mm. The firstcircuit layer 82 comprising electrically conductive material may beformed onto the lower isolation layer 76 ₁. The first circuit layer 82may have width W₂ of about 0.06 mm and thickness T₁ of about 0.002 mm.The insulation layer 84 comprising electrically nonconductive materialmay be formed onto the first circuit layer 82 and the lower isolationlayer 76 ₁. The insulation layer 84 may have width W₅ of about 0.08 mmand thickness T₄ of about 0.001 mm. The second circuit layer 86comprising electrically nonconductive material may be formed onto theinsulation layer 84. The second circuit layer 86 may have width W₂ ofabout 0.06 mm and thickness T₄ of about 0.002 mm. The upper isolationlayer 76 ₂ comprising electrically nonconductive material may be formedonto the second circuit layer 86 and the insulation layer 84. The upperisolation layer 76 ₂ may have width W₃ of about 0.15 mm and thickness T₄of about 0.001 mm. The upper shield layer 78 ₂ comprising electricallyconductive material may be formed onto the upper isolation layer 76 ₂and the lower shield layer 78 ₁. In an embodiment, the upper shieldlayer 78 ₂ may have width W₄ of about 0.4 mm and thickness T₅ of about0.002 mm. The distal and proximal ends of the first circuit layer 82 andthe second circuit layer 86 may be configured to electrically connect toelectrically operated objects located on the medical device 36. Whilevarious dimensions of the layers have been provided in detail, it willbe appreciated that this disclosure is not so limited. Rather, otherdimensions for the layers may be utilized as known to those with skillin the art and remain within the scope and spirit of this disclosure.

Additionally, while an embodiment disclosing two electrically conductivecircuit layers has been described in detail, it will be appreciated thatthis disclosure is not so limited. Rather, various embodiments of anelectrical infrastructure consistent with the teachings disclosed hereinmay comprise any number of electrically conductive circuit layers asnecessary for a particular application and remain within the scope andspirit of this disclosure. For example, an embodiment of an electricalinfrastructure may comprise only one circuit layer, whereas anotherembodiment of an electrical infrastructure may be configured to performlike a coaxial cable. A still further embodiment of an electricalinfrastructure may comprise a plurality of circuit layers as may benecessary to transmit electrical signals from an electrically operableobject located on or at the distal end 40 to the proximal end 42 of themedical device 36.

FIGS. 10A and 10B are enlarged, partial cross-sectional views, withportions broken away, of embodiments of the location sensing coil 44 ofFIG. 3, designated location sensing coils 44 a and 44 b, respectively.Location sensing coils 44 a, 44 b, may be disposed proximate the distalend 40 of the medical device 36. The location sensing coil 44 may beconfigured as an electromagnetic coil position sensor for devicenavigation in various medical procedures. In an embodiment, the locationsensing coils 44 a, 44 b, may be formed directly on the distal end 40 ofthe medical device 36 as described further herein. In addition, thelocation sensing coil 44 of FIG. 3 may alternatively be formed asdescribed in U.S. application Ser. No. 13/232,536, filed 14 Sep. 2011(the '536 application), now pending, and U.S. application Ser. No.13/341,396, filed 30 Dec. 2011 (the '396 application), now pending. The'536 application and the '396 application are both hereby incorporatedby reference as though fully set forth herein.

FIG. 10A shows the location sensing coil 44 a, which may include a corelayer 88 comprising magnetically permeable material. The core layer 88may be formed directly on the substrate 50, such as the tubular body 38of the medical device 36, or mechanically wound around a circumferentialsurface of the substrate 50. The core layer 88 may confine and guide amagnetic field and amplify it by a certain factor. The core layer 88 maycomprise a ferromagnetic material, such as but not limited to, μ-Metal.An insulative layer 90, which comprises electrically nonconductivematerial, may be directly formed on the core layer 88 by printing orother ink deposition technologies as known to those with skill in theart. A single layer coil 92 may be formed on the insulative layer 90 ina predefined pattern. In another embodiment, when the substrate 50comprises nonconductive material, the single layer coil 92 may be formeddirectly onto the substrate 50 without need for the insulative layer 90and may comprise electrically conductive material. The pattern may begenerally spiral shaped around the core layer 88 or the substrate 50. Inan exemplary and non-limiting embodiment, the single layer coil 92 mayhave a width W₆ of between about 0.0059-0.060 mm and a thickness T₆ ofbetween about 0.001-0.003 mm. In an exemplary and non-limitingembodiment, the single layer coil 92 a distance between the conductormaterial as it spirals about the core layer 88, also known as a pitch P,of between about 0.005-0.060 mm. In an exemplary and non-limitingembodiment, the single layer coil 92 may have a skew angle α as theconductor material spirals about the coil of about up to 45 degrees(skew angle α is generally illustrated in FIG. 3).

FIG. 10B shows the location sensing coil 44 b, which has a plurality oflayers, designated 92 ₁, 92 ₂, . . . , 92 _(N) wherein N=the number oflayers in the location sensing coil 44 b, and which compriseselectrically conductive material. Each layer 92 _(1-N) of locationsensing coil 44 b may be separated by a respective insulative layer 90.In an embodiment, each of the single layer coils may be electricallyconnected to each other. In another embodiment, each of the single layercoils may be electrically connected to a corresponding twisted pair ofconductors 52.

As generally illustrated in FIG. 3, the single layer coil 92 or multiplelayer coil 92 _(1-N) (when the layers are electrically connected inseries) may have a first conductor end 94 and a second conductor end 96.The first conductor end 94 and second conductor end 96 may beelectrically connected to the electrical infrastructure 48 for signaltransmission, for example the electrical infrastructure 48 d thatincludes the shielded twisted pair of conductors 80. In an embodiment, alayer of nonconductive material 98 may be formed over a portion of thelocation sensing coil 44 to allow the second conductor end 96—whichwould otherwise terminate at the distal end of the location sensing coil44, to be routed across coil 44 without electrically shorting the singlelayer coil 92. As a result, both the first and second conductor ends 94,96 present at the proximal end of the location sensing coil 44.

As also generally illustrated in FIG. 3, the proximal end of theelectrical infrastructure 48 may be connected to contact ring 46, or theplurality of contact rings 46 _(1-N) located proximate the proximal end42 of medical device 36. In embodiments, contact ring 46 may comprisethree-dimensional structural layering of conductive material andnonconductive material using methods as previously described above. Forexample, contact ring 46 ₁ may comprise a layer of conductive material.A layer of insulative material may be formed, with respect to one ormore of the contact rings 46 _(1-N), which allows other circuits fromelectrical infrastructure 48 (e.g., traces) to cross one or more of thecontact rings 46 _(1-N) without electrically shorting out on anyparticular contact ring (i.e., other than a particular trace that isintended to be electrically connected to a particular contact ring). Theother circuits may connect to contact rings 46 _(2-N).

FIG. 11 is a schematic and block diagram of one exemplary embodiment ofMPS 20, designated as a MPS 110, as seen by reference to U.S. Pat. No.7,386,339, hereby incorporated by reference as though fully set forthherein, having portions of which are reproduced below, which generallydescribes, at least in part, the MediGuide™ Technology systemcommercially offered by MediGuide Ltd. of Haifa, Israel and now owned bySt. Jude Medical, Inc. It should be understood that variations arepossible, for example, as also seen by reference to U.S. Pat. No.6,233,476, hereby incorporated by reference as though fully set forthherein. Another exemplary magnetic field-based MPS is the Carto™ systemcommercially available from Biosense Webster, and as generally shown anddescribed in, for example, U.S. Pat. Nos. 6,498,944, and 6,788,967, bothhereby incorporated by reference as though fully set forth herein.Accordingly, the following description is exemplary only and notlimiting in nature.

MPS 110 includes a location and orientation processor 150, a transmitterinterface 152, a plurality of look-up table units 154 ₁, 154 ₂ and 154₃, a plurality of digital to analog converters (DAC) 156 ₁, 156 ₂ and156 ₃, an amplifier 158, a transmitter 160, a plurality of MPS sensors162 ₁, 162 ₂, 162 ₃ and 162 _(N), a plurality of analog to digitalconverters (ADC) 164 ₁, 164 ₂, 164 ₃ and 164 _(N) and a sensor interface166.

Transmitter interface 152 is connected to location and orientationprocessor 150 and to look-up table units 154 ₁, 154 ₂ and 154 ₃. DACunits 156 ₁, 156 ₂ and 156 ₃ are connected to a respective one oflook-up table units 154 ₁, 154 ₂ and 154 ₃ and to amplifier 158.Amplifier 158 is further connected to transmitter 160. Transmitter 160is also marked TX. MPS sensors 162 ₁, 162 ₂, 162 ₃ and 162 _(N) arefurther marked RX₁, RX₂, RX₃ and RX_(N), respectively. Analog to digitalconverters (ADC) 164 ₁, 164 ₂, 164 ₃ and 164 _(N) are respectivelyconnected to sensors 162 ₁, 162 ₂, 162 ₃ and 162 _(N) and to sensorinterface 166. Sensor interface 166 is further connected to location andorientation processor 150.

Each of look-up table units 154 ₁, 154 ₂ and 154 ₃ produces a cyclicsequence of numbers and provides it to the respective DAC unit 156 ₁,156 ₂ and 156 ₃, which in turn translates it to a respective analogsignal. Each of the analog signals is respective of a different spatialaxis. In the present example, look-up table 154 ₁ and DAC unit 156 ₁produce a signal for the X axis, look-up table 154 ₂ and DAC unit 156 ₂produce a signal for the Y axis and look-up table 154 ₃ and DAC unit 156₃ produce a signal for the Z axis.

DAC units 156 ₁, 156 ₂ and 156 ₃ provide their respective analog signalsto amplifier 158, which amplifies and provides the amplified signals totransmitter 160. Transmitter 160 provides a multiple axiselectromagnetic field, which can be detected by MPS sensors 162 ₁, 162₂, 162 ₃ and 162 _(N). Each of MPS sensors 162 ₁, 162 ₂, 162 ₃ and 162_(N) detects an electromagnetic field, produces a respective electricalanalog signal and provides it to the respective ADC unit 164 ₁, 164 ₂,164 ₃ and 164 _(N) connected thereto. Each of the ADC units 164 ₁, 164₂, 164 ₃ and 164 _(N) digitizes the analog signal fed thereto, convertsit to a sequence of numbers and provides it to sensor interface 166,which in turn provides it to location and orientation processor 150.Location and orientation processor 150 analyzes the received sequencesof numbers, thereby determining the location and orientation of each ofthe MPS sensors 162 ₁, 162 ₂, 162 ₃ and 162 _(N). Location andorientation processor 150 further determines distortion events andupdates look-up tables 154 ₁, 154 ₂ and 154 ₃, accordingly.

It should be understood that system 10, particularly the main electroniccontrol unit 12, as described above may include conventional processingapparatus known in the art, capable of executing pre-programmedinstructions stored in an associated memory, all performing inaccordance with the functionality described herein. Such an electroniccontrol unit may further be of the type having both ROM, RAM, acombination of non-volatile and volatile (modifiable) memory so that anysoftware may be stored and yet allow storage and processing ofdynamically produced data and/or signals.

Although only certain embodiments have been described above with acertain degree of particularity, those skilled in the art could makenumerous alterations to the disclosed embodiments without departing fromthe scope of this disclosure. Joinder references (e.g., attached,coupled, connected, and the like) are to be construed broadly and mayinclude intermediate members between a connection of elements andrelative movement between elements. As such, joinder references do notnecessarily infer that two elements are directly connected/coupled andin fixed relation to each other. Additionally, the terms “electricallyconnected” and “in communication” are meant to be construed broadly toencompass both wired and wireless connections and communications. It isintended that all matter contained in the above description or shown inthe accompanying drawings shall be interpreted as illustrative only andnot limiting. Changes in detail or structure may be made withoutdeparting from this disclosure as defined in the appended claims.

Any patent, publication, or other disclosure material, in whole or inpart, that is said to be incorporated by reference herein isincorporated herein only to the extent that the incorporated materialsdoes not conflict with existing definitions, statements, or otherdisclosure material set forth in this disclosure. As such, and to theextent necessary, the disclosure as explicitly set forth hereinsupersedes any conflicting material incorporated herein by reference.Any material, or portion thereof, that is said to be incorporated byreference herein, but which conflicts with existing definitions,statements, or other disclosure material set forth herein will only beincorporated to the extent that no conflict arises between thatincorporated material and the existing disclosure material.

What is claimed is:
 1. A method for manufacturing an electricalinfrastructure of a medical device, said method comprising: printing abase layer comprising electrically conductive material in a predefinedpattern by depositing an electrically conductive ink on a surface of themedical device, wherein printing said predefined pattern of said baselayer comprises forming a plurality of sinusoidal-shaped segmentsseparated by a plurality of gaps wherein each sinusoidal-shaped segmentdoes not contact the other sinusoidal-shaped segments; printing amasking layer comprising electrically nonconductive material directlyover a portion of said first layer of conductive material by depositingan electrically nonconductive ink, wherein printing said masking layercomprises depositing nonconductive ink in said gaps to electricallyinsulate a portion of said segments positioned within said gaps; andprinting a bridge layer comprising electrically conductive materialdirectly over a portion of said base layer and a portion of said maskinglayer by depositing electrically conductive ink, wherein said pluralityof gaps comprises a first plurality of gaps and a second plurality ofgaps different from said first plurality of gaps and wherein formingsaid plurality of sinusoidal-shaped segments comprises forming firstsinusoidal-shaped segments separated by said first plurality of gaps andforming second sinusoidal-shaped segments different from said firstsinusoidal-shaped segments where said second sinusoidal-shaped segmentsare separated by said second plurality of gaps and wherein said secondsinusoidal-shaped segments are positioned within said first plurality ofgaps, and wherein said printing said bridge layer comprises depositingsaid electrically conductive ink in said first and second plurality ofgaps so as to electrically connect said first sinusoidal-shaped segmentsto form a first electrical conductor and to electrically connect saidsecond sinusoidal-shaped segments to form an electrically separatesecond electrical conductor to thereby form an electrically separate andisolated pair of conductors in a twisted configuration.
 2. The method ofclaim 1 further comprising printing an upper isolation layer comprisingelectrically nonconductive material and a lower isolation layercomprising electrically nonconductive material, wherein said upperisolation layer and said lower isolation layer together surround saidtwisted pair of conductors.
 3. The method of claim 2 wherein printingsaid upper and lower isolation layers comprise depositing electricallynonconductive ink.
 4. The method of claim 2 further comprising printingan upper shield layer comprising electrically conductive material and alower shield layer comprising electrically conductive material, whereinsaid upper shield layer and said lower shield layer together surround aninsulated twisted pair of conductors comprising said twisted pair ofconductors and said upper and lower isolation layers.
 5. The method ofclaim 4 wherein printing said upper and lower shield layers includescompletely surrounding said insulated twisted pair of conductor toelectrically shield said insulated twisted pair of conductors.
 6. Themethod of claim 4, wherein printing said upper and lower shield layerscomprise depositing electrically conductive ink.
 7. The method of claim4, wherein said twisted pair of conductors extend along an axis, andwherein said printing said upper and lower isolation layers comprisesdepositing nonconductive ink over a longitudinally intermediate sectionof said twisted pair of conductors thereby leaving longitudinal ends ofsaid twisted pair of conductors uncovered.
 8. The method of claim 1further comprising: providing said surface of said medical device as anelongate, tubular member comprising electrical insulating material. 9.The method of claim 8 wherein printing of said base layer of saidtwisted pair of conductors extends from about a distal end to about aproximal end of said elongate tubular member.
 10. The method of claim 1further comprising: providing a coil by printing a coil layer comprisinga length of spirally-wound electrically conductive material, whereinsaid coil layer comprises one continuous electric circuit having a firstend and a second end, said first and second ends of said coil beingelectrically connected to said twisted pair of conductors.
 11. Themethod of claim 10 further comprising: providing a core comprisingmagnetically-permeable material wherein said coil layer extends througha path spiraling around said core.
 12. The method of claim 10 whereinproviding said coil comprises printing a plurality of coil layerswherein each of said coil layers are separated by an electricallyinsulative layer comprising nonconductive ink configured to electricallyisolate adjacent coil layers.
 13. A method for manufacturing anelectrical infrastructure of a medical device, said method comprising:printing a base layer comprising electrically conductive material in apredefined pattern by depositing an electrically conductive ink on asurface of the medical device; printing a masking layer comprisingelectrically nonconductive material directly over a portion of saidfirst layer of conductive material by depositing an electricallynonconductive ink; printing a bridge layer comprising electricallyconductive material directly over a portion of said base layer and aportion of said masking layer by depositing electrically conductive inkwherein said printing said base layer and said bridge layer areperformed so as to form a twisted pair of conductors; printing an upperisolation layer comprising electrically nonconductive material and alower isolation layer comprising electrically nonconductive material,wherein said upper isolation layer and said lower isolation layertogether surround said twisted pair of conductors; and printing an uppershield layer comprising electrically conductive material and a lowershield layer comprising electrically conductive material, wherein saidupper shield layer and said lower shield layer together surround aninsulated twisted pair of conductors comprising said twisted pair ofconductors and said upper and lower isolation layers.
 14. A method formanufacturing an electrical infrastructure of a medical device, saidmethod comprising: printing a base layer comprising electricallyconductive material in a predefined pattern by depositing anelectrically conductive ink on a surface of the medical device; printinga masking layer comprising electrically nonconductive material directlyover a portion of said first layer of conductive material by depositingan electrically nonconductive ink; printing a bridge layer comprisingelectrically conductive material directly over a portion of said baselayer and a portion of said masking layer by depositing electricallyconductive ink wherein said printing said base layer and said bridgelayer are performed so as to form a twisted pair of conductors; printingan upper isolation layer comprising electrically nonconductive materialand a lower isolation layer comprising electrically nonconductivematerial, wherein said upper isolation layer and said lower isolationlayer together surround said twisted pair of conductors; printing anupper shield layer comprising electrically conductive material and alower shield layer comprising electrically conductive material, whereinsaid upper shield layer and said lower shield layer together surround aninsulated twisted pair of conductors comprising said twisted pair ofconductors and said upper and lower isolation layers; and providing acoil by printing a coil layer comprising a length of spirally-woundelectrically conductive material, wherein said coil layer comprises onecontinuous electric circuit having a first end and a second end, saidfirst and second ends of said coil being electrically connected to saidtwisted pair of conductors.